TelASIC Communications Inc., a leading developer of high-performance analog and mixed-signal integrated circuits (ICs) and sub-systems for the 3G wireless infrastructure market, today announced the closing of a $26 million Series D round of financing. ComVentures, a leading venture capital firm focused on communications technologies, led the round. Existing investors Mission Ventures, The IPO Group, Agilent Technologies, and Redpoint Ventures participated as well. "
"TelASIC will use the additional funds to support the Company's ramp into high volume production and bolster key organizational functions as it continues to grow."
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